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  • Conceptual illustration of SoftBank financing its OpenAI investment through loans and bonds

    SoftBank再借100億美元押注OpenAI：拆解借貸策略與風險

    2 個月前22 來源
  • What is SoftBank’s reported second $10 billion loan to finance its OpenAI investment, and how does it fit into the company’s broader refinan

    SoftBank再借100億美元押注OpenAI：為何要趕在2027年過橋貸款到期前籌錢？

    2 個月前19 來源
  • Illustration of JD.com, the European Commission and the Ceconomy takeover investigation

    京東收購 Ceconomy 提交補救方案，但歐盟調查細節仍未公開

    2 個月前17 來源
  • Humanoid and industrial robots operating across a connected retail, warehouse, and service infrastructure

    京東押注機械人：由賣產品到搭建具身智能商業化基建

    2 個月前26 來源
  • Illustration of a food-delivery courier wearing an AI-enabled smart helmet while riding an electric bike

    京東外賣推 AI 智能頭盔：落雨送餐都可以解放雙手

    2 個月前16 來源
  • Illustration of Xiaomi smartphones, memory chips and an electric vehicle representing the company’s Q2 2026 results

    小米2026年第二季盈利急跌42.6%：記憶體成本夾擊手機業務

    2 個月前13 來源
  • Abstract illustration of wireless networks, connected devices and digital patent licensing growth

    InterDigital衝刺2030年10億美元ARR：真正關鍵係智能手機以外市場

    2 個月前23 來源
  • What caused Xiaomi Corp.’s adjusted net income to plunge 43% to 6.22 billion yuan and revenue to fall 6.1% in the June 2026 quarter, how did

    小米次季經調整純利跌43%：記憶體荒如何同時打擊手機銷量與利潤？

    2 個月前20 來源
  • What are Xiaomi’s plans for its in house Xring D100 self driving chip—including its 3 nanometer manufacturing process, 20 core CPU, 16 core

    小米 Xring D100 晶片有幾勁？3 納米、20 核 CPU，2027 年上車

    2 個月前15 來源
  • Editorial illustration of Xiaomi’s Q2 2026 earnings, combining a premium smartphone, electric vehicle and AI circuitry

    小米2026年第二季業績：手機升級、電動車同AI有進展，但記憶體成本食掉盈利

    2 個月前25 來源
  • Conceptual illustration of Xiaomi’s Xring O3 smartphone processor powering a premium foldable phone

    Xiaomi Xring O3：自研晶片能否助力高端手機突圍？

    2 個月前13 來源
  • Editorial illustration of TSMC manufacturing Xiaomi’s Xring O3 3nm processor alongside AI and autonomous-driving chips

    台積電點解要幫小米造 Xring O3？一粒手機晶片，揭示 AI 晶片下一階段

    2 個月前15 來源
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