studioglobal
Discover

答案 - 第 474 頁 | 探索

探索
全部答案報告程式碼工作流程圖片集熱門
  • Conceptual illustration of Acer's compact Veriton RI110 AI Mini Workstation

    宏碁 Veriton RI110 登場：僅 0.63 公斤，可在本地執行最高 1,200 億參數 AI 模型

    2 個月前11 個來源
  • Illustration of Microsoft Azure cloud infrastructure, AI data centers, and financial reporting

    微軟首次揭露 Azure 營收：單季 294 億美元、全年 1,019 億美元

    2 個月前19 個來源
  • What happened when John Ternus became Apple CEO on September 1, 2026, including his first day launch of the previously dormant @johnternus a

    John Ternus 接任 Apple CEO 首日：一則「hello」貼文，透露了什麼？

    2 個月前19 個來源
  • Illustration of Claude-powered AI shopping agents helping customers and retailers manage product discovery and carts

    Anthropic 推出 Claude 購物代理藍圖：能推薦、能加購物車，但結帳仍由商家掌控

    2 個月前21 個來源
  • Illustration comparing Intel EMIB-T silicon bridges with TSMC CoWoS packaging for large AI chips and HBM stacks

    Intel EMIB-T 對決台積電 CoWoS：AI 晶片封裝的替代方案正在成形

    2 個月前40 個來源
  • Illustration of solar panels and coal power plants representing China’s changing electricity mix

    中國太陽能裝機容量首度超越煤電，但發電量仍由煤炭主導

    2 個月前16 個來源
  • What happened in the latest escalation between the United States and Iran—including President Donald Trump’s claim that U.S. forces destroye

    美伊衝突再升溫：荷莫茲海峽成為攻防核心，特朗普稱摧毀伊朗重建軍事系統

    2 個月前21 個來源
  • Illustration of XRP moving off a cryptocurrency exchange while institutional ETF inflows rise

    Binance XRP 流出看似利好，為何仍未帶動突破？

    2 個月前24 個來源
  • Illustration of enterprise SSDs and AI data-center servers amid a memory supply shortage

    AI 伺服器引爆儲存需求：2026 年第 2 季企業級 SSD 營收翻倍

    2 個月前24 個來源
  • Humanoid robot working in an automated warehouse, illustrating Goldman Sachs's Physical AI market forecast

    高盛大幅上修人形機器人預測：2035年年出貨量上看650萬台

    2 個月前20 個來源
  • Illustration of Perplexity Hybrid Compute routing AI work between cloud models and a local Apple-silicon Mac

    Perplexity Hybrid Compute：讓 Mac 在本機處理敏感 AI 工作

    2 個月前16 個來源
  • Conceptual 3D illustration of Samsung’s HBM roadmap, showing an AI processor beneath vertically stacked DRAM and logic layers

    三星三階段 HBM 路線圖：從 4nm 基礎晶粒走向 zHBM 3D 記憶體

    2 個月前34 個來源
上一頁下一頁