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  • Conceptual illustration of Acer's compact Veriton RI110 AI Mini Workstation

    宏碁发布 Veriton RI110：仅重 0.63 千克，可在本地运行最高 1200 亿参数 AI 模型

    2个月前11 来源
  • Illustration of Microsoft Azure cloud infrastructure, AI data centers, and financial reporting

    微软首次披露Azure营收：单季294亿美元，全年1019亿美元

    2个月前19 来源
  • What happened when John Ternus became Apple CEO on September 1, 2026, including his first day launch of the previously dormant @johnternus a

    What happened when John Ternus became Apple CEO on September 1, 2026, including his first-day launch of the previously dormant @johnternus a

    2个月前19 来源
  • Illustration of Claude-powered AI shopping agents helping customers and retailers manage product discovery and carts

    Anthropic 发布 Claude 购物代理蓝图：能帮你挑商品，但不能替你结账

    2个月前21 来源
  • Illustration comparing Intel EMIB-T silicon bridges with TSMC CoWoS packaging for large AI chips and HBM stacks

    英特尔 EMIB-T 对决台积电 CoWoS：AI 芯片封装的第二条路正在成形

    2个月前39 来源
  • Illustration of solar panels and coal power plants representing China’s changing electricity mix

    中国光伏装机规模首次超过煤电，但发电量仍远落后于煤电

    2个月前16 来源
  • What happened in the latest escalation between the United States and Iran—including President Donald Trump’s claim that U.S. forces destroye

    美伊冲突再升级：霍尔木兹海峡、油轮遇袭与“特朗普海峡”说法

    2个月前17 来源
  • Illustration of XRP moving off a cryptocurrency exchange while institutional ETF inflows rise

    币安 XRP 提币看似利好，但为何仍未迎来突破？

    2个月前24 来源
  • Illustration of enterprise SSDs and AI data-center servers amid a memory supply shortage

    AI服务器拉动企业级SSD营收翻倍：2026年第二季度市场冲上375.9亿美元

    2个月前24 来源
  • Humanoid robot working in an automated warehouse, illustrating Goldman Sachs's Physical AI market forecast

    高盛大幅上调人形机器人预测：2035年年出货量或达650万台

    2个月前20 来源
  • Illustration of Perplexity Hybrid Compute routing AI work between cloud models and a local Apple-silicon Mac

    Perplexity Hybrid Compute：让 Mac 处理敏感数据，云端负责复杂推理

    2个月前16 来源
  • Conceptual 3D illustration of Samsung’s HBM roadmap, showing an AI processor beneath vertically stacked DRAM and logic layers

    三星三阶段 HBM 路线图：从 4nm 基础芯片迈向 zHBM 3D 内存

    2个月前34 来源
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