Trending AI Posts & Hot Research Catchup - Page 294
easyh2power’s Two-Track Plan for Hydrogen Aircraft: Drones Now, eVTOL Later
18 sources0easyh2power’s core strategy is to commercialize low power air cooled fuel cells in drones first, while advancing 90–110 kW liquid cooled systems toward 300 kW class, airworthiness oriented applications for e...
How Xiaomi’s MiMo-V2.5 Topped OpenRouter’s Token Rankings—and What It Says About AI Adoption
19 sources0In the July 20–26 OpenRouter snapshot, Xiaomi’s MiMo V2.5 reportedly processed about 10.5 trillion weekly tokens and led a Chinese top five.
Honor Robot Phone: How ARRI Color Science, AiMAGE and a Moving Camera Aim to Make Mobile Video More Cinematic
29 sources0Honor Robot Phone’s central idea is a mobile video workflow: 10 bit ARRI LogC3, ARRI Wide Gamut 3 and ARRI Looks feed into a 200MP mechanically stabilized camera and Honor’s AiMAGE processing.
Inside China Telecom’s 1,024-Chip Domestic TPU Cluster in Hangzhou
17 sources0China Telecom’s Hangzhou branch, ZTE and Zhonghao Xinying deployed a 1,024 chip Chana TPU cluster rated at 400 PFLOPS.
China’s Hualong One and Linglong One Strategy: Can CNNC Shape Nuclear Standards?
30 sources0CNNC’s strategy is to standardize Hualong One large reactors while proving the 125 MWe Linglong One SMR for smaller, multi purpose uses.
Kimi K3’s Two-Axis Scaling Bet: Bigger MoE Models and More Inference Compute
16 sources0Moonshot’s Kimi K3 argues that frontier capability comes from two levers: scaling model capacity before deployment and spending more compute on reasoning, tools, and agentic work after deployment.
Mineng’s Neuromorphic Chip Bet: Why Event-Driven AI Could Fit Medical Devices
23 sources0Mineng Technology reportedly raised tens of millions of yuan in equity financing to commercialize a medical device focused spiking neural network chip platform.
China’s TGV Glass-Substrate Push: Building Advanced Packaging for AI Chips
27 sources0China is building a domestic TGV glass substrate supply chain for AI/HPC packaging, with reported 2027 deployment targets.
Huawei’s Tau Law: Can LogicFolding Cut Reliance on Advanced Lithography?
22 sources0Huawei’s Tau Scaling Law prioritises cutting the time signals and data need to move through chips and systems, rather than relying solely on transistor miniaturisation.
China’s Internet Giants Are Taking AI Into the Physical World
20 sources0China’s internet giants are shifting from digital platforms to physical AI systems: Meituan is commercializing drone logistics, JD.com is replicating automated warehouses, ByteDance is developing embodied AI...
WorthyAero R1: Huaxi Aviation’s Small eVTOL Bet on Tourism—and Hydrogen Flight
21 sources0Huaxi Aviation is positioning the 115 kg WorthyAero R1 less as an urban air taxi than as a single seat tourism and personal flight aircraft—and as a roughly 1:4 scale testbed for larger hydrogen hybrid eVTOLs.
China’s Advanced Packaging Push: Nearly 10 Projects, RMB 40 Billion, and an AI Focus
17 sources0China announced nearly 10 major advanced packaging projects between May and July 2026, with disclosed investment approaching RMB 40 billion—not RMB 400 billion.