Tau Scaling Law係華為喺2026年5月提出嘅新晶片設計法則,放棄傳統縮細晶體管尺寸嘅做法,改為提高訊號傳輸速度
核心技術叫LogicFolding,用3D晶片堆疊技術縮短訊號傳輸距離,從而提升效能
華為聲稱呢個方法可以喺2031年前設計出等效1.4納米製程嘅晶片,唔使靠極紫外光(EUV)光刻機
What is the Tau Scaling Law that Huawei founder Ren Zhengfei has endorsed, and how does he frame it as an existential necessity for Huawei tIllustration of 3D chip stacking — the core concept behind Huawei's Tau Scaling Law
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以下係根據現有最佳資料整合嘅答案。
乜嘢係 Tau Scaling Law?
Tau Scaling Law係華為喺2026年5月提出嘅一套全新晶片設計法則,重點係由傳統「縮細晶體管尺寸」轉為「提升訊號傳輸速度」。與其繼續同業界鬥瘦身(即係縮細納米製程),呢個Tau法則採用咗一種叫LogicFolding嘅3D晶片堆疊技術,將晶片內部嘅邏輯、模擬同記憶體電路以立體方式疊埋一齊,從而大幅縮短訊號需要傳輸嘅距離,減少傳輸時間,提升整體效能。