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AMD 砍掉 HBM，轉用 LPDDR5X！全新 Versal Premium Gen 2 MoP 晶片封裝黑科技詳解

AMD 喺 2026 年 6 月 30 日宣布 Versal Premium Gen 2 Memory on Package（MoP）自適應 SoC，係 Versal 系列首次將 LPDDR5X 記憶體直接封入晶片封裝，取代已停產嘅 Versal HBM 產品線 [1][5][7]。新版 MoP 用 LPDDR5X 記憶體，最高 32GB 容量，頻寬達 288 GB/s，雖然得 HBM2e（819 GB/s）嘅大約 35%，但 PCB 面積可以減少最多 60%，仲支援 40°C 到 +100°C 工業級溫度範圍 [1][3][7]。

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AMD Versal Premium Gen 2 MoP adaptive SoC with on-package LPDDR5X memory illustration — Search & fact-check with cited sources for What did AMD announce on June 30, 2026 regarding its Versal chip lineup, and how does the new VerAMD's Versal Premium Gen 2 MoP integrates LPDDR5X memory directly into the chip package, replacing the discontinued HBM line.
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Create a landscape editorial hero image for this Studio Global article: Search & fact-check with cited sources for What did AMD announce on June 30, 2026 regarding its Versal chip lineup, and how does the new Ver. Article summary: On June 30, 2026, AMD announced the **Versal Premium Gen 2 Memory on Package (MoP)** adaptive SoC — its first-ever Versal device to integrate LPDDR5X memory directly into the chip package, replacing the discontinued Vers. Topic tags: general, documentation, general web. Style: premium digital editorial illustration, source-backed research mood, clean composition, high detail, modern web publication hero. Use reference image context only for broad subject, composition, and topical grounding; do not copy the exact image. Avoid: logos, brand marks, copyrighted characters, real person likenesses, fake screenshots, UI text, readable text, watermarks, charts with fak
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2026 年 6 月 30 日，AMD 正式宣布推出 Versal Premium Gen 2 Memory on Package（MoP） 自適應 SoC——呢個係 Versal 系列第一次將 LPDDR5X 記憶體直接整合喺晶片封裝入面，取代咗已經停產嘅 Versal HBM 產品線。以下係兩個產品線喺幾個關鍵層面上嘅詳細比較：

記憶體技術

Versal HBM（已停產）：用 HBM2e DRAM，透過矽中介層（3D IC/SSI 技術）整合。容量有 8 GB、16 GB 或者 32 GB 三種選擇。
Versal Premium Gen 2 MoP：用 LPDDR5X 記憶體，透過有機基板封裝工藝直接整合喺封裝上面，互連間距得 0.4 毫米。最高容量達。

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