Tau Scaling Law 是华为提出的一种全新芯片设计原理,核心是从“缩小晶体管尺寸”转向“提升信号传输速度”。 该定律的关键技术“LogicFolding”采用3D芯片折叠,缩短信号传输距离,从而提升性能。 华为声称,基于该定律,到2031年可以设计出晶体管密度相当于1.4纳米制程的芯片,而无需使用极紫外光刻(EUV)设备。
What is the Tau Scaling Law that Huawei founder Ren Zhengfei has endorsed, and how does he frame it as an existential necessity for Huawei tIllustration of 3D chip stacking — the core concept behind Huawei's Tau Scaling Law
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Tau Scaling Law 是什么?
Tau Scaling Law(τ缩放定律)是华为于2026年5月提出的一种全新芯片设计原理 。它的核心思路是:不再执着于缩小晶体管尺寸,而是通过提升信号在芯片内的传输速度来提升性能 。
传统芯片行业遵循摩尔定律,通过不断微缩制程节点(如7纳米、5纳米、3纳米)来提升性能。但华为因美国制裁无法获取极紫外光刻(EUV)设备,无法走这条路。Tau Scaling Law 采用名为 “LogicFolding”(逻辑折叠) 的3D芯片堆叠技术,将逻辑、模拟和存储电路在垂直方向上紧密堆叠,从而显著缩短信号在芯片内部的传输距离,降低传输时延 。