Nvidia started shipping its Spectrum X co packaged optics (CPO) switch delivering 400 Tbps total throughput to select partners, with expanded production planned for the second half of 2026, marking a major step toward... The switch uses TSMC's COUPE platform and 3D hybrid bonding to integrate optical engines directl...

Create a landscape editorial hero image for this Studio Global article: What recent announcements did Nvidia make about shipping its Spectrum-X CPO switches (built with TSMC's COUPE platform using 3D hybrid bondi. Article summary: Here is a clear breakdown of the announcements made at Nvidia GTC Taipei (at COMPUTEX, early June 2026):. Topic tags: general, general web, user generated. Reference image context from search candidates: Reference image 1: visual subject "Nvidia senior vice president of networking Gilad Shainer poses for a photo at a display showcasing the Spectrum-X technology at Nvidia GTC Taipei on Wednesday. CNA photo June 3, 20" source context "Nvidia ships TSMC-backed CPO switches to tackle AI data center bottlenecks - Focus Taiwan" Reference image 2: visual subject "“NVIDIA's update on the Spectrum-X switch with co-packaged optics is an important moment, confirming that
Nvidia made a decisive move into the optical networking era at GTC Taipei on June 3, 2026. The company confirmed it has begun shipping its next-generation Spectrum-X co-packaged optics (CPO) switch to select partners, a product it calls the first of its kind to reach this stage. The switch will underpin the scale-out and scale-across networking fabric for the Vera Rubin AI factory platform .
The new Spectrum-X switch delivers up to 400 Tbps of total throughput, a massive leap made possible by moving optics directly onto the switch package. Instead of routing data through separate pluggable optical transceivers, CPO technology mounts the optical engines next to the switch ASIC, slashing power consumption and the distance electrical signals must travel .
At the core of this integration is TSMC’s Compact Universal Photonic Engine (COUPE) platform. It uses TSMC’s System on Integrated Chips (SoIC) technology—a form of 3D hybrid bonding—to stack and connect the photonic and electronic dies. This approach achieves an unprecedented level of integration density, letting Nvidia pack more bandwidth into a single device while keeping energy costs in check .
"The switch uses Nvidia's most advanced CPO technology," Gilad Shainer, Nvidia's senior vice president of networking, said at the event. He added that the company has already started sending units to partners and expects to expand production capacity in the second half of 2026 .
Nvidia didn’t just ship a product; it also cracked open its proprietary NVLink Fusion interconnect for the first time to outside photonics partners. Both Lightmatter and Ayar Labs announced they had joined the ecosystem, with the goal of making their CPO and near-packaged optics (NPO) products optically and electrically compatible with Nvidia’s SerDes and optical technologies .
Lightmatter is adapting its bi-directional optical link architecture—the Passage photonic interconnects and Guide laser sources—to Nvidia’s specs. This creates a unified platform for semi-custom AI factories and, crucially, eliminates the need for separate transmit and receive fibers. Lightmatter says the approach cuts fiber and connector requirements by 50%, a dramatic reduction for data centers that can require up to 300 miles of cabling .
The upshot: a customer’s semi-custom XPU can plug directly into Nvidia switch silicon through Lightmatter’s CPO or NPO products, enabling seamless multi-vendor chip connectivity inside the NVLink Fusion fabric .
Ayar Labs takes a complementary approach, focusing on connecting thousands of GPUs across multiple racks into a single unified cluster via an optical fabric. Its CPO products target the bandwidth, low latency, and power efficiency that hyperscale AI workloads demand. By joining NVLink Fusion, Ayar Labs makes its technology interoperable with Nvidia’s dominant hardware stack, helping to bring CPO closer to real-world deployment for rack-scale AI infrastructure .
The announcements fit into a longer arc that Nvidia CEO Jensen Huang has been describing since the 2025 GTC. The company’s strategy is pragmatic: use copper interconnects as long as physics allows, then switch to optics when the bandwidth and distance demands outstrip what copper can handle.
"We should use copper as much as we can, for as long as we can, but copper has its limits," Huang said at GTC Taipei. "The right strategy is to scale up with copper as long as you can. After that you scale up further with optics, you scale out with optics and you scale across with optics."
In practice, this means Nvidia’s upcoming Vera Rubin NVL72 and Kyber Ultra NVL144 systems will still rely on copper for their internal scale-up links. Full CPO-based scale-up won’t arrive until the Feynman generation in 2028 . But for the scale-out and scale-across networks that stitch entire AI factories together, the optical transition is happening now.
Nvidia’s combination of shipping a production CPO switch and opening its interconnect ecosystem to third-party photonics startups marks a turning point. The AI industry is moving from debating whether optics will matter to figuring out how quickly they can be deployed.
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Nvidia started shipping its Spectrum X co packaged optics (CPO) switch delivering 400 Tbps total throughput to select partners, with expanded production planned for the second half of 2026, marking a major step toward...
Nvidia started shipping its Spectrum X co packaged optics (CPO) switch delivering 400 Tbps total throughput to select partners, with expanded production planned for the second half of 2026, marking a major step toward... The switch uses TSMC's COUPE platform and 3D hybrid bonding to integrate optical engines directly with the switch chip, cutting power consumption and signal distance versus traditional pluggable transceivers.
Simultaneously, Lightmatter and Ayar Labs joined Nvidia's NVLink Fusion ecosystem, signaling a broader industry push toward multi vendor, CPO based heterogeneous AI infrastructure.