TSMC is reportedly considering five additional advanced packaging plants at Chiayi Science Park, which could bring its planned total there to 10. The proposed build out would follow two Phase I facilities and three planned for Phase II; reports link the additional capacity to rising AI chip and CoWoS demand.
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Create a landscape editorial hero image for this Studio Global article: What is TSMC’s reported plan to add five advanced packaging plants at Chiayi Science Park, how would the plants fit with its existing Phase. Article summary: TSMC is reportedly considering five more advanced-packaging plants at Chiayi Science Park, potentially bringing its planned total there to ten. The five-plant proposal is based on supply-chain reports and a park-expansio. Topic tags: general, government, general web, user generated. Style: premium digital editorial illustration, source-backed research mood, clean composition, high detail, modern web publication hero. Use reference image context only for broad subject, composition, and topical grounding; do not copy the exact image. Avoid: logos, brand marks, copyrighted characters, real person likenesses, fake screenshots, UI text, readable text, watermarks, cha
TSMC is reportedly considering five additional advanced-packaging plants at Chiayi Science Park in southern Taiwan. If built alongside the two Phase I facilities and three planned for Phase II, the new plants could bring the company’s planned total at the site to 10. But the five-plant proposal is based on supply-chain reporting, not a confirmed TSMC construction commitment. 2
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Reports describe two advanced-packaging facilities in Phase I, with mass production reportedly beginning in June 2026. TSMC is also planning three facilities for Phase II. The newly reported five would be a further expansion, commonly described in coverage as Phase III. 2
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The phase labels can be confusing: the government consultation has been described as covering a further expansion of the park, while local industry reporting treats that process as a starting point for Phase III. The consultation notice itself does not confirm that TSMC will build all five plants. 2
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The reported rationale is growing demand for advanced packaging as AI-chip production expands. Coverage identifies Nvidia, AMD and Apple among the companies driving demand, and points to TSMC’s CoWoS packaging technology as a particular source of capacity pressure. 1
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Advanced packaging brings chip components together as part of the process of making complex processors. More facilities could give TSMC additional room to meet that demand, but the available reporting does not quantify how much capacity the proposed plants would add or when they might begin operating. 3
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Reports put the proposed expansion area at about 198.65 hectares and describe farmland near the existing park as a potential site. That figure refers to the reported park expansion area; it does not, by itself, establish the final footprint or land allocation for TSMC’s proposed plants. 5
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The National Science and Technology Council’s public consultation is an early planning step. Reporting says the proposal would still face public comment and government review, followed by an environmental impact assessment. The notice should not be read as final approval to build. 2
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If realized, the expansion would add to Chiayi’s role in Taiwan’s efforts to develop capacity in AI and advanced packaging. The park’s development plans also identify areas such as heterogeneous integration packaging and quantum technology. 3
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For now, the central point is the distinction between a reported investment plan and an approved project: five more plants could make Chiayi a 10-facility packaging hub for TSMC, but the proposal’s scale, schedule and eventual construction remain subject to further decisions. 2
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TSMC is reportedly considering five additional advanced packaging plants at Chiayi Science Park, which could bring its planned total there to 10.
TSMC is reportedly considering five additional advanced packaging plants at Chiayi Science Park, which could bring its planned total there to 10. The proposed build out would follow two Phase I facilities and three planned for Phase II; reports link the additional capacity to rising AI chip and CoWoS demand.
The consultation concerns a proposed 198.65 hectare expansion area, but a public notice is only an early step—not final approval for construction.