Xiaomi says its Xuanjie (XRING) O3 is the first flagship mobile SoC to exceed 5 million on AnTuTu, reaching more than 5.22 million. The O3 uses a ten core all big core CPU, a 16 core G2 Ultra NX GPU and up to 113.8 GB/s of LPDDR6 bandwidth; Xiaomi claims CPU performance is up 60% and graphics performance up 85% vers...
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Create a landscape editorial hero image for this Studio Global article: What did Xiaomi announce about its Xuanjie O3 AI flagship mobile SoC—including its development timeline, 5.22-million-point AnTuTu record, t. Article summary: Xiaomi presented Xuanjie (XRING) O3 as its second in-house flagship mobile SoC, arriving 459 days after the original O1 launched in May 2025. It is a 3 nm, 24-billion-transistor chip positioned around on-device AI, flags. Topic tags: general, general web, news, user generated. Style: premium digital editorial illustration, source-backed research mood, clean composition, high detail, modern web publication hero. Use reference image context only for broad subject, composition, and topical grounding; do not copy the exact image. Avoid: logos, brand marks, copyrighted characters, real person likenesses, fake screenshots, UI text, readable text, watermarks, charts w
Xiaomi has unveiled the Xuanjie O3—also branded XRING O3—as its second in-house flagship smartphone system-on-chip. The 3nm processor is built around a clear strategy: combine flagship CPU and graphics performance with more tightly integrated on-device AI, faster memory and Xiaomi-specific software models.
The headline is a Xiaomi-reported AnTuTu score above 5.22 million, which the company and several reports describe as the first flagship mobile SoC to pass 5 million. That is an important launch claim, but it should not be treated as an independently established performance record yet. 10
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Xiaomi says the O3 arrived 459 days after the Xuanjie O1 was introduced on May 22, 2025. The company presented the chip as the next stage of its in-house silicon effort, rather than as a small refresh of the first-generation design. 20
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The O3 uses a 3nm manufacturing process and integrates 24 billion transistors. Reuters reported that TSMC is expected to manufacture the processor using its 3nm technology, citing people familiar with the matter. 33
The O3’s CPU uses an unusual all-big-core layout rather than mixing high-performance and efficiency cores. Reported specifications include:
That makes ten cores in total. Xiaomi reported a multi-core score above 15,000 and claimed a 60% improvement over the Xuanjie O1. Notebookcheck reported a Geekbench 6.5 single-core score of 3,945 and multi-core score of 15,221 from figures shared at the announcement. These are launch-era results, not a substitute for independent testing across retail devices. 1
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Graphics processing comes from the 16-core G2-Ultra NX GPU. Xiaomi says it delivers an 85% increase in graphics performance while reducing GPU power consumption by 64% compared with the previous generation. The company also highlighted third-generation ray tracing support. 3
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The design is significant for AI as well as gaming. Reporting on the chip describes dedicated neural acceleration within part of the GPU, suggesting that Xiaomi is distributing more AI work across the processor instead of treating the NPU as the only AI engine. 35
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As with the CPU figures, the GPU percentages are Xiaomi’s own comparisons. Real-world gaming performance will depend on device cooling, software support, sustained power limits and the games tested.
The Xuanjie O3 is described as the first mobile processor to support LPDDR6. Xiaomi lists speeds of up to 10,667 Mbps and memory bandwidth of 113.8 GB/s—48% higher than the O1’s reported bandwidth. 2
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Higher memory bandwidth can help applications that move large amounts of data between compute units, including high-resolution graphics, image processing and some on-device AI workloads. It does not automatically translate into a matching increase in everyday phone speed, however; software and thermal limits remain important.
Xiaomi’s most product-specific change is the redesigned neural processing unit. The company says the NPU was rebuilt for Xiaomi MiMo on-device large models and provides up to 200 TOPS of tensor compute plus 3.13 TFLOPS of vector compute. Xiaomi also claims a 45% improvement in on-device AI performance. 1
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The broader design distributes AI acceleration across the SoC’s CPU, GPU, ISP, DPU and audio-DSP subsystems. Reports cite CPU neural accelerators, additional AI capability in the GPU, an AI noise-reduction unit in the ISP and hardware AI super-resolution in the DPU. 35
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This matters more than a single TOPS number because phone AI workloads are varied. Image enhancement, speech processing, generative features and large-model inference may use different parts of the chip. Xiaomi’s approach is to make those resources available throughout the platform, while keeping MiMo as a central software use case.
The O3 includes Xiaomi’s fifth-generation image signal processor, or ISP, for computational photography and video processing. Available reports also describe support for advanced imaging features, including high-resolution sensor handling, AI night video and H.266 hardware decoding. 39
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The precise ISP feature set is not consistently documented across the available reporting, so those capabilities should be treated as announced specifications rather than independently verified camera results.
Xiaomi also highlighted RISC-V-based security components and said they had achieved relevant security certifications. The available reporting does not identify the certification names or levels clearly enough to support a more specific conclusion. Similarly, Xiaomi’s claimed 82-nanosecond static latency and low-power optimizations should be read as company claims because the measurement method is not provided. 11
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Xiaomi launched the O3 alongside two other Xuanjie processors:
The lineup shows Xiaomi positioning its silicon work beyond the smartphone application processor. O3 handles the device-level flagship platform, while O100 and D100 target larger AI and automotive workloads. 8
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Xiaomi says the O3 has entered mass production. Reuters reported an initial shipment target of roughly 200,000 to 300,000 units, indicating that the first rollout may be limited compared with the volumes of Qualcomm- or MediaTek-powered devices. 21
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The first announced phone is the Xiaomi 18 Fold, expected to launch in China in September 2026. Xiaomi has also said that the Mi Pad 9 Pro Max will be the first tablet to use the O3. 22
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The Xuanjie O3 is important less because one benchmark crossed a round number than because Xiaomi is trying to control the entire flagship computing stack. Its all-big-core CPU, new GPU, LPDDR6 interface and MiMo-focused AI architecture are designed to work as one platform.
For buyers, the practical verdict will depend on independent AnTuTu and Geekbench runs, sustained gaming tests, battery life, camera results and how many MiMo-powered features ship on the first devices. For Xiaomi, the announcement marks a faster second step into custom mobile silicon—one aimed at reducing reliance on external chip suppliers while making on-device AI a central hardware priority. 33
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Xiaomi says its Xuanjie (XRING) O3 is the first flagship mobile SoC to exceed 5 million on AnTuTu, reaching more than 5.22 million.
Xiaomi says its Xuanjie (XRING) O3 is the first flagship mobile SoC to exceed 5 million on AnTuTu, reaching more than 5.22 million. The O3 uses a ten core all big core CPU, a 16 core G2 Ultra NX GPU and up to 113.8 GB/s of LPDDR6 bandwidth; Xiaomi claims CPU performance is up 60% and graphics performance up 85% versus the O1.
The chip took 459 days to develop, has entered mass production and is expected to debut in the Xiaomi 18 Fold and Mi Pad 9 Pro Max in September 2026.