AMD Zen 7 'Grimlock': Everything We Know About the Next-Gen CPU Architecture

A fresh wave of supply-chain reports is providing the clearest picture yet of AMD's next major CPU architecture. While Zen 6 is still rolling out, attention is already shifting to its successor, codenamed "Grimlock." Based on a mix of official AMD roadmap confirmations and recent third-party leaks, Zen 7 looks set to be a significant generational leap. From a brand-new, smaller process node to a first-of-its-kind packaging technology for AMD, here’s what we know so far—and what should still be treated as rumor.

Process Node: A Two-Node Jump to TSMC’s A14

The most significant detail emerging from recent reports is the process node. AMD’s Zen 7 Core Complex Dies (CCDs), codenamed Grimlock, are expected to be fabricated on TSMC's A14 (1.4 nm-class) node . This represents a rapid two-node advancement over Zen 6, which is built on TSMC’s 2nm (N2) process .

TSMC’s A14 node is currently slated for high-volume manufacturing in 2028, which aligns with the reported timeline for Zen 7’s server and desktop launches . Industry observers note that the product timeline lines up with TSMC’s Fab 25 P1 facility in Taichung, which is scheduled to enter pilot production in 2027 and ramp up mass production in 2028 .

Packaging: AMD’s First FOPLP for Client CPUs

A major shift in packaging technology is also reportedly under evaluation. According to a supply-chain report from TrendForce, AMD is assessing Powertech Technology's (PTI) Fan-Out Panel-Level Packaging (FOPLP) solution for integrating the CCDs and the I/O die onto the substrate . This would be a first for AMD's client CPUs, moving beyond traditional substrate packaging to allow for higher integration density.

This shift focuses on the base packaging layer. AMD will continue to rely on TSMC’s SoIC-X 3D stacking for the fabrication of the CCDs and the vertical stacking of 3D V-Cache tiles . AMD has already qualified the industry’s first 2.5D panel-level Embedded Fan-Out Bridge (EFB) interconnect with PTI using FOPLP technology, a technology previously deployed in its Instinct accelerators . For Zen 7, this signals an upgrade to how the core compute tiles communicate on the package.

Architecture: Core Counts, Cache, and a 'New Matrix Engine'

On the official front, AMD's late-2025 roadmap presentation confirmed Zen 7 as a "future node" and a "true next-generation" design . The company explicitly stated that Zen 7 would introduce a new matrix engine designed to support broader AI data format handling, signaling deeper native AI capabilities within the standard CPU cores .

Unofficial leaks provide a look at the expected core configurations. The desktop platform, codenamed Grimlock Ridge, is reported to feature up to 32 cores via two 16-core CCDs paired with a ~155 mm² I/O die . This would be a 33% core count increase over the leaked 24-core Zen 6 desktop config. Each 16-core CCD is estimated to have a physical size of approximately 98 mm² .

Leaked roadmaps have also detailed two primary CCD variants under the Grimlock moniker:

• Silverton: The full-fat 16-core compute die, rumored to support aggressive clock speeds and 3D V-Cache stacking .
• Silverking: A cut-down 8-core variant that reportedly lacks 3D V-Cache support .

For cache, multiple sources suggest that high-end SKUs with 3D V-Cache could feature up to 448 MB of total L3 + V-Cache per package . Regarding the socket, leaks are conflicting: some claim desktop parts will migrate to a new AM6 platform, while others suggest chipset continuity by reusing the Zen 6 IOD to remain on AM5 .

Performance Targets: Aggressive but Unconfirmed

Performance figures are derived entirely from unofficial sources and should be treated as early targets. Leaks point to an instructions-per-clock (IPC) uplift of 15–25% over Zen 6, with an internal target of a 20%+ improvement in SPECint 2017 performance at the same clock speeds .

Some of the more speculative leaks claim that flagship desktop SKUs could approach boost clocks of 7 GHz . However, no official engineering samples or validated benchmarks exist to support these clock speed targets yet.

Expected Timeline: Late 2028 and Beyond

The timeline from supply-chain reports paints a staggered launch across server and consumer segments:

• EPYC Server Processors (“Grimlock”): Expected in late 2028, likely as the first Zen 7 products to market .
• Ryzen Consumer Desktop Processors (“Grimlock Ridge”): Expected to follow in 2029, and not before .

These estimates align with the TSMC A14 mass production schedule, but AMD’s only official language on Zen 7’s timeline remains a "post-2026" window without a specific node or date commitment .