bLLC stands for Big Last-Level Cache. Leaks consistently describe it as Intel's direct response to AMD's 3D V-Cache / X3D technology, aiming to provide a significant L3 cache boost for gaming and memory-sensitive workloads . The cache is not a single size across the lineup; it is segmented by SKU tier :
The placement of the bLLC on the ringbus within each compute tile is also a notable architectural detail . Intel's performance claims against AMD's X3D lineup remain unverified by independent benchmarks .
The highest-end Nova Lake-S SKU is reported to feature a dual-compute-tile design with a total of 52 cores and 52 threads (hyperthreading is reportedly dropped for this generation) . Leaks agree on this configuration :
A previously rumored 42-core variant was later reported to have been upgraded to 44 cores . The newer configuration is described as 16 P-cores, 24 E-cores, and 4 LP-E cores . This change is believed to free up a fully enabled compute tile that could trickle down into other SKUs .
Below the flagship, single-compute-tile SKUs are expected. A prominent rumored configuration is a 28-core part, which is often reported as 8 P-cores + 16 E-cores + 4 LP-E cores . These parts are expected to carry the Core Ultra 7 branding and feature 144 MB of bLLC . Another configuration, likely a 24-core part (4P+16E+4LPE), has also been mentioned .
Details for entry-level Core Ultra 5 and Core Ultra 3 models are less concrete, but leaks suggest configurations such as 8P+16E+4LPE, 8P+12E+4LPE, 6P+8E+4LPE, 4P+8E+4LPE, and 4P+4E+4LPE . Most of these are expected to be single-tile, non-bLLC parts . Power consumption for these lower-tier SKUs is rumored to be under 125W .
Leaks indicate that power and thermal management is a major engineering focus for the 52-core flagship . At Computex 2026, industry chatter suggested the chip would feature multi-core overclocking capabilities, requiring significant thermal headroom . Specific TDPs remain unconfirmed by Intel .
The Nova Lake-S family is expected to span from entry-level to flagship, segmented by compute tile count, bLLC cache size, and core count :
| Segment | Leaked Core Config | bLLC Cache | Notes |
|---|---|---|---|
| Core Ultra 9 | 16P + 32E + 4LPE (52 cores) | 288 MB | Dual-tile, flagship |
| Core Ultra 7 | 8P + 16E + 4LPE (28 cores) | 144 MB | Single-tile, high-end |
| Core Ultra 5 | 8P + 12E/16E + 4LPE (24-28 cores) | Unclear / None | Mid-range, likely non-bLLC SKUs |
| Core Ultra 3 | 4P + 4E/8E + 4LPE (12-16 cores) | None | Entry-level, low-power |
The compute silicon for the flagship is reported to be manufactured on TSMC's N2P process node .
All reliable leaks point to a new LGA 1954 socket for Nova Lake-S, replacing the LGA 1851 socket used by Arrow Lake-S . This means existing motherboards will not be compatible .
The platform is expected to launch with Intel's 900-series chipsets . Enthusiast-tier chatter specifically mentions Z990 and Z970 boards, alongside a mainstream B960 chipset .
Nova Lake-S is expected to natively support DDR5-8000 memory . This represents a 25% increase over Arrow Lake-S's native DDR5-6400 support . Memory modules may utilize CUDIMM and CQDIMM standards to achieve these higher frequencies .
The launch window for Nova Lake-S has been a moving target, shifting from late 2026 to early 2027, based on multiple leak reports :
Current reading: The most consistent leak-based consensus points to a Q1 2027 launch event at CES 2027, with retail availability to follow . Intel has not officially confirmed any dates .
bLLC stands for Big Last-Level Cache. Leaks consistently describe it as Intel's direct response to AMD's 3D V-Cache / X3D technology, aiming to provide a significant L3 cache boost for gaming and memory-sensitive workloads . The cache is not a single size across the lineup; it is segmented by SKU tier :
The placement of the bLLC on the ringbus within each compute tile is also a notable architectural detail . Intel's performance claims against AMD's X3D lineup remain unverified by independent benchmarks .
The highest-end Nova Lake-S SKU is reported to feature a dual-compute-tile design with a total of 52 cores and 52 threads (hyperthreading is reportedly dropped for this generation) . Leaks agree on this configuration :
A previously rumored 42-core variant was later reported to have been upgraded to 44 cores . The newer configuration is described as 16 P-cores, 24 E-cores, and 4 LP-E cores . This change is believed to free up a fully enabled compute tile that could trickle down into other SKUs .
Below the flagship, single-compute-tile SKUs are expected. A prominent rumored configuration is a 28-core part, which is often reported as 8 P-cores + 16 E-cores + 4 LP-E cores . These parts are expected to carry the Core Ultra 7 branding and feature 144 MB of bLLC . Another configuration, likely a 24-core part (4P+16E+4LPE), has also been mentioned .
Details for entry-level Core Ultra 5 and Core Ultra 3 models are less concrete, but leaks suggest configurations such as 8P+16E+4LPE, 8P+12E+4LPE, 6P+8E+4LPE, 4P+8E+4LPE, and 4P+4E+4LPE . Most of these are expected to be single-tile, non-bLLC parts . Power consumption for these lower-tier SKUs is rumored to be under 125W .
Leaks indicate that power and thermal management is a major engineering focus for the 52-core flagship . At Computex 2026, industry chatter suggested the chip would feature multi-core overclocking capabilities, requiring significant thermal headroom . Specific TDPs remain unconfirmed by Intel .
The Nova Lake-S family is expected to span from entry-level to flagship, segmented by compute tile count, bLLC cache size, and core count :
| Segment | Leaked Core Config | bLLC Cache | Notes |
|---|---|---|---|
| Core Ultra 9 | 16P + 32E + 4LPE (52 cores) | 288 MB | Dual-tile, flagship |
| Core Ultra 7 | 8P + 16E + 4LPE (28 cores) | 144 MB | Single-tile, high-end |
| Core Ultra 5 | 8P + 12E/16E + 4LPE (24-28 cores) | Unclear / None | Mid-range, likely non-bLLC SKUs |
| Core Ultra 3 | 4P + 4E/8E + 4LPE (12-16 cores) | None | Entry-level, low-power |
The compute silicon for the flagship is reported to be manufactured on TSMC's N2P process node .
All reliable leaks point to a new LGA 1954 socket for Nova Lake-S, replacing the LGA 1851 socket used by Arrow Lake-S . This means existing motherboards will not be compatible .
The platform is expected to launch with Intel's 900-series chipsets . Enthusiast-tier chatter specifically mentions Z990 and Z970 boards, alongside a mainstream B960 chipset .
Nova Lake-S is expected to natively support DDR5-8000 memory . This represents a 25% increase over Arrow Lake-S's native DDR5-6400 support . Memory modules may utilize CUDIMM and CQDIMM standards to achieve these higher frequencies .
The launch window for Nova Lake-S has been a moving target, shifting from late 2026 to early 2027, based on multiple leak reports :
Current reading: The most consistent leak-based consensus points to a Q1 2027 launch event at CES 2027, with retail availability to follow . Intel has not officially confirmed any dates .