| Fanless, DIN-rail mountable, 5.5" (140mm) depth |
| Up to 128GB DDR5, 2x 2.5GbE LAN, 2x HDMI 2.1, 0°–45°C operating range |
| Up to 180 TOPS total (CPU/GPU/NPU hybrid); integrated NPU 5 delivers 50 dedicated TOPS for real-time inferencing |
| SYS-111AD-WN2R (updated) | Intel Core Series 2 | Short-depth 1U rackmount | DDR5 memory, existing-footprint upgrade | Improved AI and compute performance vs. prior generation |
| SYS-E300-13AD5 (updated) | Intel Core Series 2 | Compact fan-based embedded | DDR5 memory, compact edge form factor | Increased AI throughput in same physical footprint |
Broader Intel Arc Pro B-Series GPU support across the edge AI server lineup: the Intel Arc Pro B70 delivers up to 367 TOPS with 32GB VRAM, while the B50 and B60 models provide professional-grade graphics acceleration for AI and visual computing workloads .
Additionally, Supermicro's Intel Edge AI platform page highlights the broader availability of systems powered by the Intel Xeon 6 SoC (up to 72 P-cores) for CPU-based inferencing with AVX2, and Intel Core Ultra processors with up to 16 P/E/LPE cores, integrated GPU with 12 Xe-cores, and 50 NPU TOPS .
The expanded portfolio is designed for retail, manufacturing, physical security, transportation, and logistics — organizations that need scalable, power-efficient AI deployed close to where data is generated . The fanless SYS-E103-14P is specifically optimized for computer vision, industrial automation, and rugged edge deployments
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These systems are explicitly positioned to support the shift toward distributed AI and agentic AI at the edge. The SYS-E103-14P enables efficient processing of agentic AI workloads without requiring a discrete GPU, processing inference tasks locally rather than in the cloud . Supermicro's broader June 2026 strategy also includes Arm AGI CPU-based servers announced at COMPUTEX for enterprise agentic AI workloads
, positioning the Intel edge portfolio as the complementary low-power, high-density edge tier for real-time decision-making at the point of data collection.
Mory Lin, Vice President of IoT/Embedded and Edge Computing at Supermicro:
"As agentic AI adoption accelerates, organizations need edge infrastructure that can deliver real-time inferencing, low-latency performance, and power efficiency close to where data is generated. Our latest Intel-powered edge systems, plus our DCBBS portfolio, give customers greater cost control and flexibility to deploy and scale AI workloads across demanding edge environments."
Dan Rodriguez, Corporate Vice President and General Manager, Edge Computing Group at Intel:
"AI workloads at the edge require a combination of high-performance compute, power efficiency, scalable acceleration, and the right total cost of ownership (TCO). By combining Intel Core Ultra processors and Arc Pro GPUs with Supermicro's edge-optimized systems, customers can deploy AI solutions faster and more efficiently across a wide range of real-world environments."
Both executives frame the partnership as a strategic hardware-software co-optimization that addresses the core tension at the edge: delivering data-center-class AI inference in space-, power-, and thermally constrained environments while maintaining cost control and deployment flexibility.
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