Samsung PM1763 Enterprise SSD: Specs, Performance, and Nvidia Vera Rubin AI Platform Details

• Sequential Read: Up to 28,400 MB/s ^CSB
• Sequential Write: Up to 21,900 MB/s (as reported by multiple press sources; Samsung's product page lists up to 21,000 MB/s) ^CSB
• Performance vs. Predecessor: Approximately 2× faster than the PCIe 5.0-based PM1753 ^SB
• LLM Transfer Time: A 40 GB large language model (comparable to a 4-bit quantized Llama 3 70B model) can be transferred in approximately 1.4 seconds ^MBY
• Interface: PCIe 6.0 with PAM4 signaling, doubling bandwidth over the previous generation (PCIe 5.0) ^CS

Capacities and Form-Factors

The PM1763 is initially offered in three capacities ^SMB:

• 4 TB
• 8 TB
• 16 TB

The official Samsung Semiconductor product page also lists support for capacities up to 64 TB in E1.S, E3.S, and U.2 form factors, enabled by the drive's 9th-generation V-NAND and a new 4-nanometer controller ^CSF.

Cooling Technology

Next-generation AI servers are increasingly moving toward liquid-cooled architectures to manage thermal output. The PM1763 is designed for this environment with Direct-to-Chip (D2C) liquid cooling ^MS.

• How it works: A cold plate attaches directly to the SSD die, enabling stable operation under high load ^MBS
• Benefit: Maintains peak performance over extended periods during demanding AI training and inference workloads ^FM

Power Efficiency

Improving power efficiency is a critical goal for data centers, where energy costs and cooling are major operational expenses. The PM1763 delivers a 1.8× improvement in power efficiency over the PM1753, helping to reduce overall operating costs ^MBI.

Security Features

Recognizing the evolving threat landscape for AI-driven data centers, Samsung equipped the PM1763 with advanced security capabilities designed to protect data at rest, in transit, and in use ^ISL.

• Post-Quantum Cryptography (PQC): Includes PQC encryption algorithms to protect data against future quantum-computing-based attacks ^MSL
• TEE Device Interface Security Protocol (TDISP): Supports Trusted Execution Environment (TEE) security for virtualized and AI-driven data center infrastructures, providing link-level encryption ^SLL
• Additional Protocols: Also supports SPDM (Security Protocol and Data Model) 1.4 and CNSA (Commercial National Security Algorithm Suite) 2.0 ^SL

Validation and Supply Status

The PM1763 has passed Nvidia's qualification for the Vera Rubin platform and entered mass production as of July 7-8, 2026 ^SS. According to industry reports, Samsung and Micron are currently the two companies mass-producing eSSDs for Vera Rubin, while SK Hynix is still in the preparation stage and has not yet begun supply for this platform ^TX.

Broader Context: HBM4 Certification and Industry Trends

The PM1763 launch is part of a larger strategy by Samsung to provide a "total memory solution" for Nvidia's AI platforms, extending beyond its role as an HBM4 supplier ^KN.

HBM4 Certification: On June 5, 2026, Nvidia CEO Jensen Huang confirmed that all three major memory manufacturers — Samsung, SK Hynix, and Micron — have been certified to supply HBM4 memory for the Vera Rubin platform ^BBT. This marks a significant milestone for the AI supply chain, ensuring a diversified and competitive supply base.

Industry Trends: The shift toward AI inference workloads is expected to significantly increase NAND flash demand. High-performance eSSDs like the PM1763 are designed to reduce data-transfer bottlenecks between storage, CPUs, and GPUs in both training and inference pipelines, enabling faster and more efficient AI processing ^SSF.