Samsung Sees HBM Taking Nearly 30% of DRAM Capacity in 2027

Samsung Electronics expects high-bandwidth memory (HBM) to account for nearly 30% of the DRAM industry’s wafer capacity in 2027, compared with about 20% currently. The forecast highlights a trade-off in the memory market: more capacity devoted to AI-focused HBM could mean less available for standard DRAM. 17

What the 30% forecast means

The figure refers to the share of wafer capacity allocated to HBM—not HBM’s share of all DRAM chips or memory output. Samsung executive vice president Kim Taewoo said the expected share would rise from about one-fifth currently to nearly three-tenths next year. 17

It is an industry forecast, not a guarantee that the allocation will reach that level. But it signals how much production resources manufacturers may direct toward HBM as demand for AI computing grows.

Why HBM can constrain standard DRAM

HBM and conventional DRAM compete for the same wafer capacity, according to Samsung. If manufacturers allocate more of that capacity to HBM, less may remain for standard DRAM, potentially constraining its supply. 17

That does not mean every increase in HBM production will translate directly into a specific reduction in standard DRAM output. The reported forecast describes a capacity shift and its potential effect, rather than a precise supply shortfall. 17

Why AI systems use HBM

HBM is made by stacking memory chips vertically. This arrangement allows processors to access data at high speeds, making the memory an important component in AI computing. 4

The leading HBM producers named in industry coverage include South Korea’s SK hynix and Samsung Electronics, as well as U.S.-based Micron Technology. 10