HBM Could Take Nearly 30% of DRAM Wafer Capacity in 2027

Samsung Electronics expects high-bandwidth memory (HBM) to use nearly 30% of DRAM makers’ total wafer capacity in 2027, compared with about 20% in 2026. The forecast highlights a trade-off for memory makers: expanding production of the memory used in AI computing could leave less shared wafer capacity for standard DRAM. 1

Why HBM growth could constrain standard DRAM

Samsung Executive Vice President Kim Taewoo said HBM and standard DRAM compete for the same wafer capacity. As manufacturers devote more of that capacity to HBM, less may be available for conventional DRAM production. The forecast describes a potential supply constraint; it does not, by itself, quantify how much standard DRAM supply will fall. 1

Why AI computing uses HBM

HBM is made from vertically stacked memory chips, a design that lets processors access data at high speeds. That performance makes it an important component in AI computing. 18

The companies in the HBM market

The market is dominated by South Korea’s SK Hynix and Samsung Electronics, and US-based Micron Technology, according to the cited report. 3

The key figure to watch is the share of wafer capacity allocated to HBM: nearly 30% in 2027, versus about 20% currently. How that allocation affects standard DRAM supply will depend on how manufacturers use their shared capacity. 1