How Huawei Built a 122TB SSD Using Die‑on‑Board Packaging
Huawei achieved 122TB SSD capacity mainly by redesigning packaging: its Die‑on‑Board (DoB) method mounts NAND dies directly onto the PCB instead of using packaged chips, allowing far higher density even without the ne... The drives are used in Huawei’s OceanStor Pacific scale‑out storage systems, where dense NVMe SS...
Huawei achieved 122TB SSD capacity mainly by redesigning packaging: its Die‑on‑Board (DoB) method mounts NAND dies directly onto the PCB instead of using packaged chips, allowing far higher density even without the ne...
The drives are used in Huawei’s OceanStor Pacific scale‑out storage systems, where dense NVMe SSDs enable up to 4PB of storage in a 2U chassis.
Huawei’s roadmap includes 245TB AI‑focused SSDs such as the OceanDisk LC 560, competing with ultra‑capacity drives like Micron’s 245TB 6600 ION.
How did Huawei manage to build a 122TB SSD despite U.SHigh‑capacity enterprise SSD designs increasingly rely on advanced stacking and packaging techniques to push single‑drive capacity past 100TB.
AI Prompt
Create a landscape editorial hero image for this Studio Global article: How did Huawei manage to build a 122TB SSD despite U.S. export restrictions on advanced NAND chips, what is its Die-on-Board packaging techn. Article summary: Huawei appears to have reached 122TB mainly by changing packaging, not by suddenly gaining access to the newest export-restricted NAND. According to a recent analyst-briefing report, Huawei used proprietary Die-on-Board . Topic tags: general, general web, user generated. Reference image context from search candidates: Reference image 1: visual subject "# How Solidigm Drives the Foundation of Innovation in SSD Packaging Technology. Parking garage as metaphor for a 122TB SSD innovation for die, packages, and form factors. When we t" source context "How Solidigm Drives the Foundation of Innovation in SSD ..." Reference image 2: visual subject "# Huawei’s new stack
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The key idea: increase density through packaging, not newer NAND
Huawei’s 122TB‑class SSDs are notable because they appeared despite U.S. export restrictions that limit access to the most advanced memory technologies. The company’s approach focuses less on cutting‑edge NAND fabrication and more on how the memory dies are packaged and assembled.
According to industry reporting, Huawei developed a proprietary Die‑on‑Board (DoB) packaging technique that places NAND dies directly onto the SSD’s base printed circuit board rather than inside separate chip packages first. This allows many more flash dies to be packed into the same physical space, dramatically increasing capacity per drive.
In other words, the breakthrough is largely in assembly density, not necessarily in the underlying NAND process technology.
What Die‑on‑Board (DoB) packaging does differently
Most enterprise SSDs follow a traditional manufacturing flow:
NAND dies are stacked and sealed inside chip packages (often TSOP or BGA packages).
These packaged chips are then soldered onto the SSD’s PCB.
This two‑step approach simplifies manufacturing but introduces extra physical overhead from chip casings, bonding structures, and spacing.
Huawei’s DoB approach removes that intermediate packaging step. Instead, the NAND dies are mounted directly onto the SSD’s PCB substrate as part of a wafer‑level assembly process.
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What is the short answer to "How Huawei Built a 122TB SSD Using Die‑on‑Board Packaging"?
Huawei achieved 122TB SSD capacity mainly by redesigning packaging: its Die‑on‑Board (DoB) method mounts NAND dies directly onto the PCB instead of using packaged chips, allowing far higher density even without the ne...
What are the key points to validate first?
Huawei achieved 122TB SSD capacity mainly by redesigning packaging: its Die‑on‑Board (DoB) method mounts NAND dies directly onto the PCB instead of using packaged chips, allowing far higher density even without the ne... The drives are used in Huawei’s OceanStor Pacific scale‑out storage systems, where dense NVMe SSDs enable up to 4PB of storage in a 2U chassis.
What should I do next in practice?
Huawei’s roadmap includes 245TB AI‑focused SSDs such as the OceanDisk LC 560, competing with ultra‑capacity drives like Micron’s 245TB 6600 ION.
How Huawei Built a 122TB SSD Using Die‑on‑Board Packaging
Huawei achieved 122TB SSD capacity mainly by redesigning packaging: its Die‑on‑Board (DoB) method mounts NAND dies directly onto the PCB instead of using packaged chips, allowing far higher density even without the ne... The drives are used in Huawei’s OceanStor Pacific scale‑out storage systems, where dense NVMe SS...
Huawei achieved 122TB SSD capacity mainly by redesigning packaging: its Die‑on‑Board (DoB) method mounts NAND dies directly onto the PCB instead of using packaged chips, allowing far higher density even without the ne...
The drives are used in Huawei’s OceanStor Pacific scale‑out storage systems, where dense NVMe SSDs enable up to 4PB of storage in a 2U chassis.
Huawei’s roadmap includes 245TB AI‑focused SSDs such as the OceanDisk LC 560, competing with ultra‑capacity drives like Micron’s 245TB 6600 ION.
How did Huawei manage to build a 122TB SSD despite U.SHigh‑capacity enterprise SSD designs increasingly rely on advanced stacking and packaging techniques to push single‑drive capacity past 100TB.
AI Prompt
Create a landscape editorial hero image for this Studio Global article: How did Huawei manage to build a 122TB SSD despite U.S. export restrictions on advanced NAND chips, what is its Die-on-Board packaging techn. Article summary: Huawei appears to have reached 122TB mainly by changing packaging, not by suddenly gaining access to the newest export-restricted NAND. According to a recent analyst-briefing report, Huawei used proprietary Die-on-Board . Topic tags: general, general web, user generated. Reference image context from search candidates: Reference image 1: visual subject "# How Solidigm Drives the Foundation of Innovation in SSD Packaging Technology. Parking garage as metaphor for a 122TB SSD innovation for die, packages, and form factors. When we t" source context "How Solidigm Drives the Foundation of Innovation in SSD ..." Reference image 2: visual subject "# Huawei’s new stack
openai.com
The key idea: increase density through packaging, not newer NAND
Huawei’s 122TB‑class SSDs are notable because they appeared despite U.S. export restrictions that limit access to the most advanced memory technologies. The company’s approach focuses less on cutting‑edge NAND fabrication and more on how the memory dies are packaged and assembled.
According to industry reporting, Huawei developed a proprietary Die‑on‑Board (DoB) packaging technique that places NAND dies directly onto the SSD’s base printed circuit board rather than inside separate chip packages first. This allows many more flash dies to be packed into the same physical space, dramatically increasing capacity per drive.
In other words, the breakthrough is largely in assembly density, not necessarily in the underlying NAND process technology.
What Die‑on‑Board (DoB) packaging does differently
Most enterprise SSDs follow a traditional manufacturing flow:
NAND dies are stacked and sealed inside chip packages (often TSOP or BGA packages).
These packaged chips are then soldered onto the SSD’s PCB.
This two‑step approach simplifies manufacturing but introduces extra physical overhead from chip casings, bonding structures, and spacing.
Huawei’s DoB approach removes that intermediate packaging step. Instead, the NAND dies are mounted directly onto the SSD’s PCB substrate as part of a wafer‑level assembly process.
Studio Global AI
Continue your research
This page includes a source-backed answer you can continue inside Studio Global.
What is the short answer to "How Huawei Built a 122TB SSD Using Die‑on‑Board Packaging"?
Huawei achieved 122TB SSD capacity mainly by redesigning packaging: its Die‑on‑Board (DoB) method mounts NAND dies directly onto the PCB instead of using packaged chips, allowing far higher density even without the ne...
What are the key points to validate first?
Huawei achieved 122TB SSD capacity mainly by redesigning packaging: its Die‑on‑Board (DoB) method mounts NAND dies directly onto the PCB instead of using packaged chips, allowing far higher density even without the ne... The drives are used in Huawei’s OceanStor Pacific scale‑out storage systems, where dense NVMe SSDs enable up to 4PB of storage in a 2U chassis.
What should I do next in practice?
Huawei’s roadmap includes 245TB AI‑focused SSDs such as the OceanDisk LC 560, competing with ultra‑capacity drives like Micron’s 245TB 6600 ION.
Higher density: More NAND dies can fit on the same board area.
Reduced packaging overhead: Eliminates the space used by chip housings and leads.
Better stacking flexibility: Designers can arrange dies in tighter or more customized layouts.
Because the capacity of an SSD ultimately depends on how many NAND dies it contains, improving packaging density can push total capacity significantly higher without requiring new semiconductor nodes.
Where Huawei’s high‑capacity SSDs are deployed today
Huawei is already using these high‑density SSDs in its OceanStor Pacific distributed storage systems, which are designed for massive unstructured data workloads.
For example, the OceanStor Pacific 9926 system supports multiple large NVMe SSD capacities and packs them into a very dense chassis configuration. Official specifications highlight:
15.36TB, 30.72TB, and 61.44TB NVMe SSD options in current product listings.
36 drive slots in a 2U chassis, enabling extremely dense deployments.
Up to about 4PB of capacity in 2U, depending on configuration and data reduction.
Industry reporting also notes configurations using 122.88TB SSDs, which can push system‑level capacity even higher—for example, tens of drives in a single enclosure delivering multi‑petabyte storage density.
These platforms are typically aimed at large‑scale workloads such as:
AI data lakes
Content storage and streaming platforms
Backup and archival systems
Massive unstructured datasets
Huawei’s roadmap: 245TB AI SSDs
Huawei has also announced a new generation of AI‑oriented SSDs under the OceanDisk product line. These drives target machine‑learning workloads where datasets and model checkpoints can reach petabyte scale.
The flagship OceanDisk LC 560 is designed primarily for capacity. Reported specifications include:
Up to 245TB per SSD
Sequential read bandwidth around 14.7 GB/s
Optimizations for large AI training datasets and multimodal data processing
The company positions these drives as a way to handle the massive data throughput required by modern AI training clusters while reducing reliance on expensive memory technologies such as high‑bandwidth memory (HBM).
How Huawei compares with Micron’s 245TB SSD
Huawei’s strategy contrasts with that of established NAND leaders such as Micron.
Micron’s 6600 ION SSD is a commercial enterprise drive with:
Up to 245.76TB usable capacity
Built using 276‑layer G9 QLC 3D NAND
Deployment in hyperscale, cloud, and enterprise data centers
In other words, Micron’s approach relies on the latest high‑layer NAND fabrication to increase density, while Huawei emphasizes packaging and system design innovations to extract more capacity from available memory dies.
Why packaging innovation matters in modern SSDs
The rise of ultra‑large SSDs shows that storage density is no longer determined only by semiconductor process advances. System‑level engineering—such as stacking methods, packaging, firmware, and controller architecture—can also significantly influence how much storage fits into a drive.
Huawei’s Die‑on‑Board packaging demonstrates how manufacturers can push SSD capacity higher even when constrained by supply chains or access to the newest semiconductor nodes. At the same time, competitors like Micron continue to advance capacity through ever‑denser NAND layers and new enterprise SSD platforms.
Both approaches are now converging on the same goal: single drives approaching or exceeding a quarter‑petabyte of storage, designed for the massive datasets powering modern AI and hyperscale infrastructure.
yicaiglobal.comChina's Huawei Unveils Solid-State Drives for AI Computing
Higher density: More NAND dies can fit on the same board area.
Reduced packaging overhead: Eliminates the space used by chip housings and leads.
Better stacking flexibility: Designers can arrange dies in tighter or more customized layouts.
Because the capacity of an SSD ultimately depends on how many NAND dies it contains, improving packaging density can push total capacity significantly higher without requiring new semiconductor nodes.
Where Huawei’s high‑capacity SSDs are deployed today
Huawei is already using these high‑density SSDs in its OceanStor Pacific distributed storage systems, which are designed for massive unstructured data workloads.
For example, the OceanStor Pacific 9926 system supports multiple large NVMe SSD capacities and packs them into a very dense chassis configuration. Official specifications highlight:
15.36TB, 30.72TB, and 61.44TB NVMe SSD options in current product listings.
36 drive slots in a 2U chassis, enabling extremely dense deployments.
Up to about 4PB of capacity in 2U, depending on configuration and data reduction.
Industry reporting also notes configurations using 122.88TB SSDs, which can push system‑level capacity even higher—for example, tens of drives in a single enclosure delivering multi‑petabyte storage density.
These platforms are typically aimed at large‑scale workloads such as:
AI data lakes
Content storage and streaming platforms
Backup and archival systems
Massive unstructured datasets
Huawei’s roadmap: 245TB AI SSDs
Huawei has also announced a new generation of AI‑oriented SSDs under the OceanDisk product line. These drives target machine‑learning workloads where datasets and model checkpoints can reach petabyte scale.
The flagship OceanDisk LC 560 is designed primarily for capacity. Reported specifications include:
Up to 245TB per SSD
Sequential read bandwidth around 14.7 GB/s
Optimizations for large AI training datasets and multimodal data processing
The company positions these drives as a way to handle the massive data throughput required by modern AI training clusters while reducing reliance on expensive memory technologies such as high‑bandwidth memory (HBM).
How Huawei compares with Micron’s 245TB SSD
Huawei’s strategy contrasts with that of established NAND leaders such as Micron.
Micron’s 6600 ION SSD is a commercial enterprise drive with:
Up to 245.76TB usable capacity
Built using 276‑layer G9 QLC 3D NAND
Deployment in hyperscale, cloud, and enterprise data centers
In other words, Micron’s approach relies on the latest high‑layer NAND fabrication to increase density, while Huawei emphasizes packaging and system design innovations to extract more capacity from available memory dies.
Why packaging innovation matters in modern SSDs
The rise of ultra‑large SSDs shows that storage density is no longer determined only by semiconductor process advances. System‑level engineering—such as stacking methods, packaging, firmware, and controller architecture—can also significantly influence how much storage fits into a drive.
Huawei’s Die‑on‑Board packaging demonstrates how manufacturers can push SSD capacity higher even when constrained by supply chains or access to the newest semiconductor nodes. At the same time, competitors like Micron continue to advance capacity through ever‑denser NAND layers and new enterprise SSD platforms.
Both approaches are now converging on the same goal: single drives approaching or exceeding a quarter‑petabyte of storage, designed for the massive datasets powering modern AI and hyperscale infrastructure.
yicaiglobal.comChina's Huawei Unveils Solid-State Drives for AI Computing
