How Huawei Built a 122TB SSD Using Die‑on‑Board Packaging

Because the capacity of an SSD ultimately depends on how many NAND dies it contains, improving packaging density can push total capacity significantly higher without requiring new semiconductor nodes.

Where Huawei’s high‑capacity SSDs are deployed today

Huawei is already using these high‑density SSDs in its OceanStor Pacific distributed storage systems, which are designed for massive unstructured data workloads.

For example, the OceanStor Pacific 9926 system supports multiple large NVMe SSD capacities and packs them into a very dense chassis configuration. Official specifications highlight:

• 15.36TB, 30.72TB, and 61.44TB NVMe SSD options in current product listings.
• 36 drive slots in a 2U chassis, enabling extremely dense deployments.
• Up to about 4PB of capacity in 2U, depending on configuration and data reduction.

Industry reporting also notes configurations using 122.88TB SSDs, which can push system‑level capacity even higher—for example, tens of drives in a single enclosure delivering multi‑petabyte storage density.

These platforms are typically aimed at large‑scale workloads such as:

• AI data lakes
• Content storage and streaming platforms
• Backup and archival systems
• Massive unstructured datasets

Huawei’s roadmap: 245TB AI SSDs

Huawei has also announced a new generation of AI‑oriented SSDs under the OceanDisk product line. These drives target machine‑learning workloads where datasets and model checkpoints can reach petabyte scale.

The flagship OceanDisk LC 560 is designed primarily for capacity. Reported specifications include:

• Up to 245TB per SSD
• Sequential read bandwidth around 14.7 GB/s
• Optimizations for large AI training datasets and multimodal data processing

The company positions these drives as a way to handle the massive data throughput required by modern AI training clusters while reducing reliance on expensive memory technologies such as high‑bandwidth memory (HBM).

How Huawei compares with Micron’s 245TB SSD

Huawei’s strategy contrasts with that of established NAND leaders such as Micron.

Micron’s 6600 ION SSD is a commercial enterprise drive with:

• Up to 245.76TB usable capacity
• Built using 276‑layer G9 QLC 3D NAND
• Deployment in hyperscale, cloud, and enterprise data centers

In other words, Micron’s approach relies on the latest high‑layer NAND fabrication to increase density, while Huawei emphasizes packaging and system design innovations to extract more capacity from available memory dies.

Why packaging innovation matters in modern SSDs

The rise of ultra‑large SSDs shows that storage density is no longer determined only by semiconductor process advances. System‑level engineering—such as stacking methods, packaging, firmware, and controller architecture—can also significantly influence how much storage fits into a drive.

Huawei’s Die‑on‑Board packaging demonstrates how manufacturers can push SSD capacity higher even when constrained by supply chains or access to the newest semiconductor nodes. At the same time, competitors like Micron continue to advance capacity through ever‑denser NAND layers and new enterprise SSD platforms.

Both approaches are now converging on the same goal: single drives approaching or exceeding a quarter‑petabyte of storage, designed for the massive datasets powering modern AI and hyperscale infrastructure.